PURPOSE: To prevent dusts from being adhered to the surface of a semiconductor wafer by injecting gas stream from a nozzle along the surface of the wafer simultaneously at the time of attracting and holding the wafer.
CONSTITUTION: An attracting plate 1 is opposed to the rear surface of a semiconductor wafer 5 to be supported and steadily inserted. The attracting surface of the plate 1 has many pores. A switch 6 is turned ON in the vicinity that the top of a nozzle base 3 is inserted into the vicinity of the top of the wafer 5 to evacuate a pipe 2 in negative pressure, compressed air is fed from the pipe 4, the plate 1 attracts the wafer 5, and air is diffused along the surface of the wafer from many nozzle holes formed at the base 3. The air diffusing can protect a semiconductor against dusts floating in the space, and dusts already adhered can be blown away to reduce improper semiconductors.
KAJI RYOKICHI
KANBARA HIDEAKI
UEDA SHINJIRO
