Title:
センサチップおよび電子機器
Document Type and Number:
Japanese Patent JP7055544
Kind Code:
B2
Abstract:
An imaging device comprises a sensor substrate including a pixel array that includes at least a first pixel. The first pixel includes an avalanche photodiode including a light receiving region, a cathode, and an anode. The first pixel includes a wiring layer electrically connected to the cathode and arranged in the sensor substrate such that the wiring layer is in a path of incident light that exits the light receiving region.
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Inventors:
Akira Tanaka
Yusuke Otake
Toshifumi Wakano
Yusuke Otake
Toshifumi Wakano
Application Number:
JP2016231585A
Publication Date:
April 18, 2022
Filing Date:
November 29, 2016
Export Citation:
Assignee:
Sony Semiconductor Solutions Corporation
International Classes:
H01L31/107
Domestic Patent References:
| JP2016062996A | ||||
| JP2014203961A | ||||
| JP2010147474A | ||||
| JP2015026708A | ||||
| JP2015084392A | ||||
| JP2004273640A | ||||
| JP2014225647A |
Foreign References:
| US20030218120 | ||||
| US20130193546 |
Attorney, Agent or Firm:
Takashi Nishikawa
Yoshio Inamoto
Yusuke Miura
Yoshio Inamoto
Yusuke Miura
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