センサ装置およびセンサ装置の製造方法

Japanese Patent JP7252048

B2

To provide a highly sensitive, low manufacturing cost, miniaturized and highly reliable sensor device and a method of manufacturing thereof, in which the sensor device may be various sensor devices having an opening to exposed a sensor unit therefrom.SOLUTION: A sensor device, having an opening to expose a sensor unit, includes: a base substrate having a sensor unit; and a lid substrate having the opening to expose the sensor unit therefrom. The base substrate and the lid substrate are airtightly bonded to each other at an outer peripheral portion of the sensor unit and a peripheral portion of the base substrate. A method of manufacturing the sensor device, includes: preparing a first assembled substrate in which the sensor unit is formed in a matrix shape; preparing a second assembled substrate in which the opening to exposed the sensor unit is formed in a matrix shape; superimposing both assembled substrates so that the sensor unit and the opening are aligned with each other, and bonding both assembled substrates at the outer peripheral portion of the sensor unit and at a region surrounding the sensor unit at a side of the sensor unit of a planned cutting region of the first assembled substrate and the second assembled substrate; and cutting both assembled substrates at the planned cutting region to be separated into individual pieces.SELECTED DRAWING: Figure 2

Hiroyuki Kuchichi

JP2019084723A

April 04, 2023

April 25, 2019

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New Japan Radio Microdevices Co., Ltd.

H01L23/02; G01N27/00; G01N27/04; G01N27/12; G01N27/22

JP2011097026A
JP2015148540A
JP2009288138A
JP2011114054A
JP2005354081A
JP2004184145A
JP2019028055A

Patent Attorney Corporation Asahina Patent Office

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