Title:
SHAPE MEASURING APPARATUS AND SHAPE MEASURING METHOD OF SOLDER FILLET
Document Type and Number:
Japanese Patent JP2000304520
Kind Code:
A
Abstract:
To measure the whole shape of a solder fillet like a chip component which is packaged in high density.
A solder fillet 3 is lighted at any time with illuminations 11-16 by control of an illumination control part 9 and the image is picked up every lighting with a CCD camera 10. In an image processing part 17, inclination of the solder fillet 3 at an adress is obtained on the basis of luminance of a picture element of the same adress in each picked-up image. A relational expression of a straight line is obtained by mathematically approximating the inclination and integrated. Thereby the shape of the solder fillet is approximated to a quadratic function and measured.
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Inventors:
SASADA KATSUHIRO
Application Number:
JP11569799A
Publication Date:
November 02, 2000
Filing Date:
April 23, 1999
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H05K3/34; G01B11/24; (IPC1-7): G01B11/24; H05K3/34
Attorney, Agent or Firm:
Keisei Nishikawa (1 person outside)