To provide a shield capped electronic component capable of preventing the occurrence of short-circuitting in advance even if an external stress is applied or electronic components are off-positioned.
The shield capped electronic component comprising a rotary substrate 11 on an upper surface of which electronic component elements are mounted and a shield cap body 13 configured so as to cover the electronic component elements on a circuit substrate which are adhered or bonded to the upper surface or side of the circuit substrate 11, wherein an insulating layer 15 is formed on the internal surfaces of laterally opposed sidewall potions which compart an opening 14 between at least a ceiling portion of the metal shield cap body and an upper surface of the circuit substrate 15.
Morita Tetsuji
Teruichi Hirai