Title:
SHIELD STRUCTURE OF ELECTROMAGNETIC COUPLING
Document Type and Number:
Japanese Patent JP3277979
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve the shield performance of electromagnetic coupling of high frequency apparatus and simplify the assembling work.
SOLUTION: The mounting region of a printed board 5 is divided into halves. In one half, circuit elements 22 are mounted on front side of the board 5 while in the other half circuit elements 23 are mounted on the back side of the board 5. Ground electrodes 21a and 21b are formed on the opposite entire sides to those on which the circuit elements 22 and 23 are mounted.
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Inventors:
Michihiro Komatsu
Ken Morii
Ken Morii
Application Number:
JP31272095A
Publication Date:
April 22, 2002
Filing Date:
November 30, 1995
Export Citation:
Assignee:
Alps Electric Co., Ltd.
International Classes:
H04B1/26; H04B15/02; H05K1/02; H05K9/00; (IPC1-7): H05K9/00
Domestic Patent References:
| JP62291201A | ||||
| JP7283573A | ||||
| JP5211485A | ||||
| JP61142497U | ||||
| JP58155899U | ||||
| JP6367295U | ||||
| JP5984887U | ||||
| JP497397U | ||||
| JP157831U |
Attorney, Agent or Firm:
Kenjiro Take (2 outside)
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