PURPOSE: To execute an electromagnetic shielding countermeasure only to dis crete IC emitting obstruction electromagnetic waves by covering the ICs disposed onto a printed substrate with a metallic plate, connecting the ICs to a grounding circuit for the substrate and using the ICS as shield plates for an electromag netic wave obstruction countermeasure.

CONSTITUTION: An IC 2 is mounted to a substrate 5, and a shield plate 1 is inserted from the upper section of the IC. Consequently, terminals 3 for connecting a grounding circuit are inserted to the grounding circuit 4 arranged onto the substrate 5, and the shield plate 1 is connected to the grounding circuit 4 when the substrate 5 is soldered. As a result, an electromagnetic shielding function for an electromagnetic wave obstruction countermeasure is acquired. The terminals 3 for connecting the grounding circuit for the shield plate 1 simultaneously function as terminals for fixation. Accordingly, the upper section of an IC chip in the IC2, in which an electromagnetic wave obstruction is most generated, in electronic components on the printed substrate 5 can be electromag netically shielded.