Title:
エレクトロニクスアセンブリにおける遮蔽
Document Type and Number:
Japanese Patent JP7251932
Kind Code:
B2
Abstract:
Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.
Inventors:
Scott Mockler
Timothy Swetlun
Kevin Byrd
Timothy Swetlun
Kevin Byrd
Application Number:
JP2018143277A
Publication Date:
April 04, 2023
Filing Date:
July 31, 2018
Export Citation:
Assignee:
Intel Corporation
International Classes:
H05K9/00; H01L23/36; H01L25/00; H05K1/02; H05K1/18
Domestic Patent References:
| JP2001135775A | ||||
| JP2004134669A | ||||
| JP201682022A |
Foreign References:
| WO2007069789A1 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki
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