ミリ波用途のための一体化された受動構成部品をもつSiベース・パッケージ - INTERNATIONAL BUSINESS MASCHINES CORPORATION

Title:

ミリ波用途のための一体化された受動構成部品をもつSiベース・パッケージ

Document Type and Number:

Japanese Patent JP4996384

Kind Code:

B2

Abstract:

An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.

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Inventors:

Nils Denneke Hoivic
John Michael Cott
John Wurich Knickerbocker
Brian Paul Gaucher
Janutz Gurujib
Christopher Vincent Yarnes
John Harold Marger Line
Silag Shriakant Patel
Duixian Liu
Wurich Earl Pfeiffer
Cornelia Can First Tsang

Application Number:

JP2007195973A

Publication Date:

August 08, 2012

Filing Date:

July 27, 2007

Export Citation:

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Assignee:

INTERNATIONAL BUSINESS MASCHINES CORPORATION

International Classes:

H01Q23/00; H01L23/12; H01L23/14; H01L25/00; H01Q19/06; H01Q19/10; H01Q19/12

Domestic Patent References:

JP2006019368A
JP2001267842A
JP2002094322A
JP2005020389A

Foreign References:

WO2006028136A1
WO2000048269A1

Attorney, Agent or Firm:

Takeshi Ueno
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi

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