Title:
シリコーン組成物およびその硬化物
Document Type and Number:
Japanese Patent JP7196802
Kind Code:
B2
Abstract:
This silicone composition contains: 100 parts by mass of (A) an organopolysiloxane which has at least one silicon atom-bonded alkenyl group per molecule and has a viscosity at 25°C of 0.01-100 Pa·s; 0.1-100 parts by mass of (B) an organohydrogenpolysiloxane having at least one silicon atom-bonded hydrogen atom per molecule; (C) an addition reaction catalyst; and 10-500 parts by mass of (D) a hollow inorganic filler having an average particle diameter of 100 μm or less. The silicone composition has a high storage elastic modulus under high frequency conditions and gives a cured product having a low density.
Inventors:
Akira Sakamoto
Matsumoto Nobuaki
Kazuma Ishida
Matsumoto Nobuaki
Kazuma Ishida
Application Number:
JP2019168468A
Publication Date:
December 27, 2022
Filing Date:
September 17, 2019
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/07; C08K3/013; C08L83/04; C08L83/05; H01L23/29; H01L23/31
Domestic Patent References:
| JP2017206652A | ||||
| JP2010155946A | ||||
| JP2004026875A | ||||
| JP2006052760A | ||||
| JP11269388A | ||||
| JP2010150399A | ||||
| JP2014218564A |
Attorney, Agent or Firm:
Patent Attorney Corporation Eimei International Patent Office
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