Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
絹電子部品
Document Type and Number:
Japanese Patent JP2013533754
Kind Code:
A
Abstract:
The invention relates to silk electronic components and methods for fabricating the same. The silk electronic components can be used as novel devices, such as implantable bioelectric and/or biophotonic devices, biosensors, surveillance devices, invisible cloaks, electromagnetic concentrators or antennas.

Inventors:
Kaplan, David
Omenetto, Fiorenzo
Amsden, Jason
Tao, Who
Richard Aberitt
Strick Weda, Andrew
Than, Shin
Twiolis, Constantinos
Application Number:
JP2013505073A
Publication Date:
August 29, 2013
Filing Date:
April 12, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Tufts University
Trustees of Boston University
International Classes:
A61L27/00; B05D7/00; B05D7/24; H01P7/08; H01Q1/24; H01Q1/38; H01Q15/02
Domestic Patent References:
JP2010508852A2010-03-25
JP2007520369A2007-07-26
JP2010503238A2010-01-28
JP2011199254A2011-10-06
JP2011504421A2011-02-10
Foreign References:
US20070007661A12007-01-11
WO2008137703A12008-11-13
WO2009061823A12009-05-14
WO2006101223A12006-09-28
Other References:
BIOMACROMOLECULES, 2008, VOL.9, NO.4, PP.1214-1220, JPN6015012987, ISSN: 0003043069
高分子学会予稿集, 1989, VOL.38, NO.9, PP.3053-3055, JPN6015012988, ISSN: 0003043070
APPLIED PHYSICS LETTERS, 2010.01.07, VOL.96, PP.011906-1-3, JPN6015049463, ISSN: 0003212204
Attorney, Agent or Firm:
Hidesaku Yamamoto
Natsuki Morishita