Title:
SILVER COATED COPPER POWDER, AND COPPER PASTE, CONDUCTIVE COATING AND CONDUCTIVE SHEET USING THE SAME
Document Type and Number:
Japanese Patent JP2016139598
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a silver coated copper powder capable of suitably being used as applications such as a conductive paste or an electromagnetic wave-shielding while maintaining excellent conductivity by increasing contacts of copper powder each other.SOLUTION: The silver coated copper powder is a silver coated copper powder 1 having a shape of an aggregate by aggregating a plurality of copper particles with a divided piece shape 2 and a surface coated with silver, and the silver coated copper particles 2 each have a flat sheet shape having average major axis diameter d of 0.5 μm to 5 μm and cross section average length of 0.02 μm to 1.0 μm measured by a scanning electron microscopy (SEM) observation and average particle diameter (D50) measured by a laser diffraction scattering type particle size distribution measurement method of the copper powder 1 of 1.0 μm to 30 μm.SELECTED DRAWING: Figure 1
Inventors:
OKADA HIROSHI
Application Number:
JP2015158961A
Publication Date:
August 04, 2016
Filing Date:
August 11, 2015
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
H01B5/00; B22F1/00; B22F1/02; B22F9/00; C09D5/24; C09D201/00; H01B1/00; H01B1/22; H05K9/00
Attorney, Agent or Firm:
Masayuki Masabayashi
Hayashi Ichiyoshi
Hayashi Ichiyoshi
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