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Title:
SILVER-PLATED LAYER DISSOLUTION SOLUTION, SILVER-PLATED LAYER DISSOLUTION METHOD, AND QUANTITATIVE METHOD OF SILVER-PLATED LAYER-CONTAINED ELEMENT
Document Type and Number:
Japanese Patent JP2012194024
Kind Code:
A
Abstract:

To provide a silver-plated layer dissolution solution, a silver-plated layer dissolution method, and a quantitative method of a silver-plated layer-contained element which suppress dissolution of a metal base material on which a silver-plated layer is formed to selectively dissolve only the silver-plated layer, have high safety to a human body and the environment, and can perform a quantitative analysis of an element contained in the silver-plated layer efficiently and accurately.

An object to be processed which has a silver-plated layer formed on the surface of a metal base material other than silver is immersed in a dissolution solution containing a carboxylic acid compound and hydrogen peroxide. Preferably, the content of carboxylic acid is 10 ml/l or more and 100 ml/l or less, and the content of hydrogen peroxide is 900 ml/l or more and 990 ml/l or less.


Inventors:
YAMAMOTO FUMITAKA
Application Number:
JP2011057582A
Publication Date:
October 11, 2012
Filing Date:
March 16, 2011
Export Citation:
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Assignee:
SUMIKO TECHNO-RESEARCH CO LTD
International Classes:
G01N1/28; C23F1/00; C23F1/44; C25D21/12; G01N33/20
Attorney, Agent or Firm:
伊賀 誠司
小池 晃
祐成 篤哉
藤井 稔也
野口 信博