Title:
SILVER POWDER, CONDUCTIVE PASTE, SILVER POWDER PRODUCTION METHOD AND MIXED SILVER POWDER
Document Type and Number:
Japanese Patent JP2023049023
Kind Code:
A
Abstract:
To provide a silver powder which can be used as a conductive paste for a wire and barely causes a break in the wire even if it is made narrower in width, the silver powder having a reduced volume resistivity compared with the conventional one, a conductive paste comprising the silver powder as a conductive filler, and a silver powder production method.SOLUTION: A silver powder as an aggregate of silver grains has an apparent density of 8.2 or more to 9.2 g/cm3 or less, in which a ratio between the line length of an outer circumferential line in the grain cross-section of the silver grains and the line length of a line circumscribed with the cross-section of the grains is 1.1 or more to 1.4 or less.SELECTED DRAWING: None
Inventors:
FUJII MASANORI
TAKAHASHI SATORU
HIRATA AKITSUGU
NAKANOYA TARO
TAKAHASHI SATORU
HIRATA AKITSUGU
NAKANOYA TARO
Application Number:
JP2022152974A
Publication Date:
April 07, 2023
Filing Date:
September 26, 2022
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO
International Classes:
B22F1/00; B22F1/05; B22F1/06; B22F1/103; B22F9/00; B22F9/24; H01B1/00; H01B1/22; H01B5/00; H01B13/00
Domestic Patent References:
| JP2006193795A | 2006-07-27 | |||
| JP2012251208A | 2012-12-20 |
Foreign References:
| KR20180121190A | 2018-11-07 | |||
| WO2014038611A1 | 2014-03-13 |
Attorney, Agent or Firm:
Kenji Sugimura
Toshio Fukui
Toshio Fukui