Title:
SILVER POWDER AND CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2023152678
Kind Code:
A
Abstract:
To provide a silver powder which has sufficient conductivity even when an addition amount to a resin is small, and can prepare a paste having high thixotropic properties.SOLUTION: A silver powder contains dendrite silver particles, wherein a cumulative particle diameter D50 at a cumulative volume of 50 vol.%, measured by a laser diffraction scattering particle size distribution measurement method, is 0.3 μm or more and 2.0 μm or less, and a BET specific surface area is 6.5 m2/g or more and 10.0 m2/g or less. The silver powder contains dendrite silver particles, wherein an L* value in an L*a*b* color system is 40 or more and 55 or less, an a* value is -2.0 or more and 1.0 or less, and a b* value is 5 or more and 10 or less.SELECTED DRAWING: Figure 1
Inventors:
OCHI KENTARO
KABASHIMA TAKAMASA
OKUBO TAMAO
KABASHIMA TAKAMASA
OKUBO TAMAO
Application Number:
JP2023004277A
Publication Date:
October 17, 2023
Filing Date:
January 16, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD
International Classes:
B22F1/00; B22F1/05; B22F1/06; B22F1/10; B22F9/24; H01B1/22
Attorney, Agent or Firm:
Patent Attorney Showa International Patent Office