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Title:
SIMULATION DEVICE OF SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING APPARATUS PROVIDED WITH THE SIMULATION DEVICE
Document Type and Number:
Japanese Patent JP2004014927
Kind Code:
A
Abstract:

To provide a simulation device of a semiconductor manufacturing apparatus which can confirm a series of normal operations of the semiconductor manufacturing apparatus without performing the actual operation thereof, and also to provide a semiconductor manufacturing apparatus comprising the same simulation device.

A plasma treatment apparatus 11 is provided with a control device (APC server) 41, and the control device 41 is connected to an input/output device 51. The control device 41 instructs, when the plasma treatment apparatus 11 performs the actual device manufacturing process, the plasma treatment apparatus 11 to perform the predetermined etching process based on data detected by electric measuring devices 17, 20, gas flow rate sensors 27, 29, a temperature sensor 13b, a pressure sensor 12a, and a plasma emission spectroscope 31. Meanwhile, the control device 41 performs the operation simulation of the plasma treatment apparatus 11 when the apparatus does not perform the device manufacturing process.


Inventors:
KOBAYASHI RYOKO
TANAKA NAOHITO
Application Number:
JP2002168654A
Publication Date:
January 15, 2004
Filing Date:
June 10, 2002
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/3065; (IPC1-7): H01L21/3065
Attorney, Agent or Firm:
Toshihiko Watanabe