To provide a single crystal diamond cutting tool and a method for manufacturing the single crystal diamond cutting tool, allowing reduction of manufacturing cost by suppressing an increase of a blade part.
Rake face and flank are formed in this single crystal diamond having a material particle size of less than 1 mm. The whole size of the blade part 30 can be suppressed from being unnecessarily increased as compared with a portion concerning cutting. As a result, the manufacturing cost can be reduced. Namely, rough diamond of the comparatively large-sized (5 mm square, for instance) single crystal diamond which can be machined into chips is not required to be prepared. Cluster diamond (the so-called "waste diamond" sorted as out of the specification in refining since an external size of the diamond is small) to be used for a diamond grinding tool, etc. can be utilized.
JP2006281376A | 2006-10-19 | |||
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