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Title:
SINGLE CRYSTAL DIAMOND CUTTING TOOL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
Japanese Patent JP2010036296
Kind Code:
A
Abstract:

To provide a single crystal diamond cutting tool and a method for manufacturing the single crystal diamond cutting tool, allowing reduction of manufacturing cost by suppressing an increase of a blade part.

Rake face and flank are formed in this single crystal diamond having a material particle size of less than 1 mm. The whole size of the blade part 30 can be suppressed from being unnecessarily increased as compared with a portion concerning cutting. As a result, the manufacturing cost can be reduced. Namely, rough diamond of the comparatively large-sized (5 mm square, for instance) single crystal diamond which can be machined into chips is not required to be prepared. Cluster diamond (the so-called "waste diamond" sorted as out of the specification in refining since an external size of the diamond is small) to be used for a diamond grinding tool, etc. can be utilized.


Inventors:
SHIMODA YOICHIRO
Application Number:
JP2008201464A
Publication Date:
February 18, 2010
Filing Date:
August 05, 2008
Export Citation:
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Assignee:
OSG CORP
International Classes:
B23B27/20; B23B27/14; B23B27/18; B23P15/30
Domestic Patent References:
JP2006281376A2006-10-19
JP2006015412A2006-01-19
JP2002254212A2002-09-10
JP2004050365A2004-02-19
Attorney, Agent or Firm:
Patent Service Corporation Shinmei Century