Title:
サブアレイを有する単一パッケージフェイズドアレイモジュール
Document Type and Number:
Japanese Patent JP5763235
Kind Code:
B2
Abstract:
Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.
Inventors:
Telesfer camgain
Adele A. Echelvini
Adele A. Echelvini
Application Number:
JP2014048166A
Publication Date:
August 12, 2015
Filing Date:
March 11, 2014
Export Citation:
Assignee:
Intel Corporation
International Classes:
H01Q3/26; H01Q3/24; H01Q15/08; H01Q21/06; H01Q23/00; H04B7/10
Domestic Patent References:
| JP2156706A | ||||
| JP2002111359A | ||||
| JP9130139A | ||||
| JP9246859A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki