PURPOSE: To obtain a single-sided flexible copper plated board which is enhanced in dimensional stability, heat resistance, and adhesive properties by a method wherein a polyimide film is bonded to a copper foil with adhesive agent specified in glass transition temperature, and the side of the polyimide film opposite to the copper foil is roughened.
CONSTITUTION: A polyimide film 3 serving as a board and a copper foil 1 serving as a circuit are bonded together with polyimide adhesive agent 2 whose glass transition temperature is 200 to 250°C, and the side of the polyimide film 3 opposite to the copper foil 1 is mechanically roughened to 0.4 to 1.0μm in average roughness. By this setup, the glass transition temperature of the adhesive agent 2 used for a single-sided flexible copper plate becomes 200°C or above, so that the adhesive agent 2 is hardly softened by heat at lamination, and the formed circuit is restrained from getting out of place or getting out of position due to the shrinkage of a base material. As the surface of the polyimide film 3 is roughened, a single-sided flexible copper board is enhanced in adhesive power and reliability after lamination.
IMAIZUMI JUNICHI
NAGAO KOICHI
SUZUKI MASAKATSU
