焼結用組成物、銀ナノ粒子の製造方法、回路基板、および、回路基板の製造方法

Title:

焼結用組成物、銀ナノ粒子の製造方法、回路基板、および、回路基板の製造方法

Document Type and Number:

Japanese Patent JP7170439

Kind Code:

B2

Abstract:

An object of the present invention is to provide a composition for sintering capable of suppressing a crack from occurring in a wiring after sintering. Provided is the composition for sintering including silver nanoparticles, an organic dispersant for coating the silver nanoparticles, and a solvent. When the composition for sintering is heated, a weight loss rate in a range of 260° C. to 600° C. is 2.92% or less.

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Inventors:

Sorato Fukushima
Akihiko Hanya

Application Number:

JP2018129747A

Publication Date:

November 14, 2022

Filing Date:

July 09, 2018

Export Citation:

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Assignee:

Stanley Electric Co., Ltd.

International Classes:

H01B1/22; B22F1/0545; B22F1/102; B22F7/04; B22F9/24; B82Y30/00; B82Y40/00; H01B1/00; H01B5/14; H01B13/00; H05K1/09

Domestic Patent References:

JP2016164864A
JP2010080438A

Attorney, Agent or Firm:

Sannozaka Patent Office

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