Title:
SLITTER DEVICE AND MANUFACTURING METHOD OF PACKAGE
Document Type and Number:
Japanese Patent JP2007111833
Kind Code:
A
Abstract:
To provide a slitter device which reproduces cutting with a clearance while suppressing cost, and a manufacturing method of a package by using the device.
In this slitter device to be used for manufacturing the package, a relief part 21 forming a prescribed clearance Z in a space with a cutting edge 14 at a sheet carrying-in side end part in a lap part with a cutting edge 14 of a lower blade 12 is provided at a cutting edge 13 of each upper blade 11. A radial width of the relief part 21 is set to be smaller than lap margins P of both the cutting edges 13 and 14.
Inventors:
SHIMOKOSHI TSUTOMU
Application Number:
JP2005306748A
Publication Date:
May 10, 2007
Filing Date:
October 21, 2005
Export Citation:
Assignee:
SHINETSU POLYMER CO
International Classes:
B26D1/24; B65H35/02; B65B15/04
Domestic Patent References:
| JP2003145484A | 2003-05-20 | |||
| JP2001287194A | 2001-10-16 | |||
| JPH01246094A | 1989-10-02 | |||
| JP2001315089A | 2001-11-13 | |||
| JPH10244487A | 1998-09-14 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama
Suzuki Mitsuyoshi
Kazuya Nishi
Yasuhiko Murayama