Title:
SOFT SOLDER FOR THERMOELECTRIC COOLING DEVICE AND THERMOELECTRIC COOLING DEVICE
Document Type and Number:
Japanese Patent JP3670432
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To suppress the joule calorification of a device for joining by soft solder semiconductor for thermoelectric cooling and substrate conductor to an initial very small amount of calorification, and to display efficiently cooling performance by the Peltier effect of the thermoelectric cooling device by incorporating one kind or two kinds of Sb, Ag, Bi and Cu by a specific weight ratio and Pb as the remainder.
SOLUTION: A skull consisting of a main body part containing 5 to 15wt.% Sb and Pb as the remainder, and inevitable impurities, or a skull consisting of a main body part containing 5 to 15wt.% Sb, 0.01 to 5wt.% each for one kind or two kinds or over of Ag, Bi and Cu, and Pb as the remainder, and inevitable impurities, is obtained. After working this skull to ribbon shape, fine wire shape or powder shape, it is used for joining by soft solder semiconductor and conductor in the thermoelectric cooling device. It is preferable that its melting point is 200 to 300°C. Also, for the lead, after obtaining work lead by usual refining, the work lead is refined to the purity of 99.9% or over by a usual refining method. And, the refined work lead is used.
Inventors:
Hamada Yoshito
Application Number:
JP4303697A
Publication Date:
July 13, 2005
Filing Date:
February 12, 1997
Export Citation:
Assignee:
Uchihashi STEC Co., Ltd.
International Classes:
B23K35/26; H01L23/38; H01L35/08; H01L35/32; (IPC1-7): B23K35/26; H01L23/38; H01L35/08; H01L35/32
Domestic Patent References:
| JP7321379A | ||||
| JP5055638A | ||||
| JP59070490A | ||||
| JP55141397A |
Attorney, Agent or Firm:
Mikatsu Matsutsuki