PURPOSE: To increase the arrangement region of signal lines and circuit components while maintaining compactness, and improve image quality and function, by drawing out flexible printed boards from two facing directions, bending one of them, stretching it lamination-wise in one direction, and distributing signal wiring.
CONSTITUTION: Flexible wiring boards 13a, 13b in a solid-state image sensing module are provided with corresponding signal wirings. Electric connection of the flexible wiring boards 13a, 13b to the terminal 8a side of a glass substrate 8 is performed in the manner in which the flexible wiring boards 13a, 13b are divided into the facing sides of a solid-state image sensing element 9. The one flexible board 13b is bent 180° and stretched in the same direction as the other flexible wiring board 13a. Circuit components 14 are mounted and arranged on the flexible wiring boards 13a, 13b. Thereby high quality image can be obtained, and compactness is also ensured and exhibited.
HIRAI HIROYUKI
FUKUOKA YOSHITAKA
Next Patent: SOLID STATE IMAGE SENSING MODULE AND ENDOSCOPE EQUIPMENT