Title:
SOLDER ALLOY AND JOINED BODY OBTAINED BY USING THE SAME
Document Type and Number:
Japanese Patent JP2011230165
Kind Code:
A
Abstract:
To provide a new solder alloy which can allow oxide materials to be joined to each other at low temperature and can suppress a temporal change being a white turbidity phenomenon, which is believed to be caused when the solder alloy is oxidized, while keeping the characteristics of a Sn-Bi-Mg-based solder alloy having excellent joint strength and airtightness.
The new solder alloy comprises 30.0-70.0 mass% Bi, 0.01-1.00 mass% Mg, 0.05-5.00 mass% Sb and the balance of Sn and inevitable impurities and satisfies a Mg/Sb ratio of 0.01-0.40.
Inventors:
MORIWAKI TAKAYUKI
CHIWATA NOBUHIKO
CHIWATA NOBUHIKO
Application Number:
JP2010103169A
Publication Date:
November 17, 2011
Filing Date:
April 28, 2010
Export Citation:
Assignee:
HITACHI METALS LTD
International Classes:
B23K35/26; B23K1/19; C22C12/00; C22C13/02; C03C27/08
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