Title:
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDER JOINT, AND SUBSTRATE
Document Type and Number:
Japanese Patent JP2021045791
Kind Code:
A
Abstract:
To provide: e.g., an Sn-Bi-Cu-Ni based solder alloy which has a low melting point, excellent ductility and high tensile strength, where a solder joint formed by soldering the solder alloy onto a Cu electrode that has been undergone an electroless Ni plating treatment exhibits high shear strength; an Sn-Bi-Cu-Ni based solder alloy where a solder joint formed by soldering the solder alloy onto a Cu electrode that has not been undergone any plating treatment also exhibits high shear strength; and, e.g., a solder alloy capable of inhibiting yellowing of the solder alloy and also inhibiting a viscosity change of a solder paste over time.SOLUTION: A solder alloy is composed of, in mass%, 31-59% of Bi, 0.3-1.0% of Cu, 0.01-0.06% of Ni, 0.0040-0.025% of As, and the balance being Sn, and has an As-rich layer.SELECTED DRAWING: Figure 1
Inventors:
KAWASAKI HIROYOSHI
SHIRATORI MASATO
KAWAMATA YUJI
SHIRATORI MASATO
KAWAMATA YUJI
Application Number:
JP2020193910A
Publication Date:
March 25, 2021
Filing Date:
November 20, 2020
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/26; B23K35/14; B23K35/22; C22C12/00; C22C13/02; H05K3/34
Attorney, Agent or Firm:
Hideki