Title:
SOLDER ALLOY, SOLDER PASTE, SOLDER BALL, SOLDER PREFORM, SOLDERED JOINT, AND CIRCUIT
Document Type and Number:
Japanese Patent JP2021045792
Kind Code:
A
Abstract:
To provide: a solder alloy which has excellent heat cycle characteristics and inhibits copper leaching, yellowing, and a viscosity rise of a solder paste over time; and a solder paste, a solder ball, a solder preform, a soldered joint, and a circuit.SOLUTION: A solder alloy is composed of, in mass%, 2.8-4% of Ag, 1.5-6% of Bi, 0.8-1.2% of Cu, 0.0040-0.025% of As, and the balance being Sn, and has an As-rich layer.SELECTED DRAWING: Figure 1
Inventors:
KAWASAKI HIROYOSHI
SHIRATORI MASATO
KAWAMATA YUJI
SHIRATORI MASATO
KAWAMATA YUJI
Application Number:
JP2020193912A
Publication Date:
March 25, 2021
Filing Date:
November 20, 2020
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/26; C22C13/00; C22C13/02; H05K3/34
Attorney, Agent or Firm:
Hideki