Title:
SOLDER COATING METHOD
Document Type and Number:
Japanese Patent JPH04247880
Kind Code:
A
Abstract:
PURPOSE: To form a solder layer having a uniform thickness by forming a solder layer by a substitution plating method on the copper pattern surface of a copper lined laminate.
CONSTITUTION: Copper foil 2 is laminated on a substrate 1 consisting of a glass epoxy resin, etc., to form the copper lined laminate. The solder layer 11 is formed by the substitution plating method on the surface of the copper patterns of the copper lined laminate. The solder layer is uniformly formed in a short period of time with simple equipment in this way.
More Like This:
Inventors:
NAKAMURA YUKIO
UMIBE SUSUMU
UMIBE SUSUMU
Application Number:
JP747491A
Publication Date:
September 03, 1992
Filing Date:
January 25, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C23C18/16; H05K3/34; (IPC1-7): C23C18/16
Domestic Patent References:
| JPH02213250A | 1990-08-24 | |||
| JPH0263345A | 1990-03-02 | |||
| JPS63117535A | 1988-05-21 | |||
| JPH02190056A | 1990-07-26 |
Attorney, Agent or Firm:
Shuji Matsumura (2 outside)