PURPOSE: To effectively and securely dip many electronic parts by superimposing the electronic parts in a direction where a chuck mechanism is disposed perpendicularly to the direction of arrangement of a lead, and closely aligning and gripping the same.

CONSTITUTION: A chuck mechanism 11 comprises two chuck arms 12 rotatable around the center of shafts parallely arranged at a predetermined interval, and a holding plate 13 disposed on the tip end of the chuck arm 12. Hereby, many electronic parts 1 are closely arranged and gripped along the direction d of the thickness of each parts. The electronic parts 1 sent from a previous process are positioned and stopped along the direction of the thickness d of a parts body 2 and are supplied to a solder tank. Since a plurality of leads 3 are disposed in the width direction W perpendicular to the thickness d of the parts body 2, a solder is satisfactorily adhered to all leads 3. Further, since the number of the electronic parts which can be held at a time is greater, the number of times of scraping of a solder liquid level is reduced, and hence the amount of a wasteful solder is reduced.