To provide a soldering paste capable of forming a soldered part having sufficient strength, and a soldering method using the soldering paste.
In the soldering method to solder a terminal 4a of an electronic component 1 to an electrode 2 of a substrate 1, the soldering paste 3 including solder particles 6, a thermosetting flux including a thermosetting resin and having the active effect of removing an oxide solder layer, and metal powder 7 having the melting point higher than that of the solder, capable of preventing generation of an oxide film in the atmosphere, and having the wet-spreading nature of the solder in a molten and fluidized state of the solder particles along the surface is interposed between the electrode 2 and the terminal 4a, the solder particles 6 are melted by the reflow so as to be wet-spread along the surface of the metal powder 7, and the molten solder 6a is brought into contact with the electrode 2 and the terminal 4a to form a soldered part. Solder flowability in the reflow process is ensured, a normal soldered part can be formed, and the soldering strength can be ensured thereby.
COPYRIGHT: (C)2006,JPO&NCIPI
Tadahiko Sakai
| JP2003117681A | ||||
| JP2000031210A |
Hiroki Naito
Daisuke Nagano