Title:
SOLDER PARTICLES
Document Type and Number:
Japanese Patent JP2023153934
Kind Code:
A
Abstract:
To provide solder particles capable of forming an anisotropic conductive material excellent in conduction reliability and insulation reliability.SOLUTION: Solder particles have a flat portion on a part of a surface.SELECTED DRAWING: Figure 1
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Inventors:
AKAI KUNIHIKO
EJIRI YOSHINORI
OKADA YUHEI
MORIYA TOSHIMITSU
SUGATA SHINICHIRO
MIYAJI KATSUMASA
EJIRI YOSHINORI
OKADA YUHEI
MORIYA TOSHIMITSU
SUGATA SHINICHIRO
MIYAJI KATSUMASA
Application Number:
JP2023126432A
Publication Date:
October 18, 2023
Filing Date:
August 02, 2023
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
B23K35/14; B23K35/26; B23K35/30
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano
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