To eliminate surely the remaining of solder paste in the rear of a screen mask and thereby to improve the quality of printing by determining the presence or absence of oozing of the solder paste by applying a recognition camera and a storage device, and by removing the oozing of the solder paste as occasion demands.
In a positioning process F8, a recognition camera is moved to a position of inspection in the rear of a screen mask. In a process F9, an image from the recognition camera is taken in after completion of the positioning process and the quantity of solder paste in an image picked up in the visual field of the recognition camera is determined. It is judged whether the solder paste detected on the basis of this measured information oozes in the rear of the screen mask or not. A recovery process 10 is a process wherein the solder paste oozing in the rear of the screen mask is removed in the case when the oozing thereof is detected in the inspection process.
OE KUNIO
TSUKUDA TAKEO
INUZUKA RYOJI
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