Title:
ソルダペースト
Document Type and Number:
Japanese Patent JP6849923
Kind Code:
B2
Abstract:
To provide solder paste that can make both viscosity-increase restraining effect and reliability compatible with good balance.SOLUTION: The solder paste according to the invention is made of a solder material and a flux. The solder material contains Sn or Sn-based alloy, 20-300 mass.ppm of As, and 50 mass.ppm to 3.0 mass% of Bi, and the flux contains metal deactivator and the metal deactivator contains a nitrogen compound.SELECTED DRAWING: None
Inventors:
River saki Hiroyuki
Masato Shiratori
Masato Shiratori
Application Number:
JP2018141540A
Publication Date:
March 31, 2021
Filing Date:
July 27, 2018
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B23K35/22; B23K35/26; B23K35/363; C22C13/00; C22C13/02
Domestic Patent References:
| JP2002224881A | ||||
| JP2015098052A | ||||
| JP2003285197A | ||||
| JP2015123491A |
Foreign References:
| WO2002043916A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Tetsuo Tsuchiya
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Tetsuo Tsuchiya