Title:
SOLDER RESIST COMPOSITION, CURED PRODUCT AND THREE-DIMENSIONAL CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2022107532
Kind Code:
A
Abstract:
To provide a solder resist composition with excellent laser aperture and adhesion to substrates.MEANS: A solder resist composition is characterized in that it contains at least (A) epoxy resin, (B) epoxidized polybutadiene resin, (C) filler, (D) imidazole curing catalyst, and (E) black colorant.SELECTED DRAWING: None
Inventors:
SHIMOKAWA AI
SHIINA MOMOKO
SHIINA MOMOKO
Application Number:
JP2022001680A
Publication Date:
July 21, 2022
Filing Date:
January 07, 2022
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
H05K3/28; C08G59/20; H05K3/18
Attorney, Agent or Firm:
Nakamura Yukitaka
Miyajima Manabu
Asano Mari
Kazuma Kojima
Miyajima Manabu
Asano Mari
Kazuma Kojima
Previous Patent: JPWO2022107531
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