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Patent Searching and Data


Title:
SOLDER SUPPLYING DEVICE
Document Type and Number:
Japanese Patent JPS59191566
Kind Code:
A
Abstract:

PURPOSE: To provide a solder supplying device which assists the early learning of a soldering operation and makes the operation efficient by providing a means for pouring preliminarily melted solder and means for controlling the rate of pouring.

CONSTITUTION: This device is provided with a container 1 contg. solder, a cap 2 for said container, a groove 4 for leading said solder to the outside, a contact part 5 which plays the role of a valve between the groove and the container 1, an iron tip 3 and a coil spring 6 for pressing the part 5 between the iron tip 3 and the container 1 to a bottom surface. The tip of a general soldering iron is removed and the above-described device is inserted thereto and the end of the tip 3 is lightly pressed to an object to be soldered to perform soldering. Then the part 5 is opened and the molten solder in the container 1 is poured along the groove 4, by which the object is soldered. The amt. of the solder in this stage is easily controlled by the force and time for pressing lightly the contact part.


Inventors:
SAITOU TATSUO
Application Number:
JP6479683A
Publication Date:
October 30, 1984
Filing Date:
April 13, 1983
Export Citation:
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Assignee:
NIPPON ELECTRIC CO
International Classes:
B23K3/06; (IPC1-7): B23K3/06
Attorney, Agent or Firm:
Uchihara Shin