Title:
SOLDER SUPPLYING UNIT
Document Type and Number:
Japanese Patent JPH10202363
Kind Code:
A
Abstract:
To provide a solder supplying unit which facilitates the soldering work and has high working efficiency and high safety.
An incorporating parts 11, 12 for incorporating the solder, a supplying part 13 fitted to the tip part of the incorporating part and supplying the solder by holding/releasing and a feeding-out part 14 fitted to the side surface of the incorporating part and holding/releasing the solder in the supplying part while linking with the supplying part and feeding out the solder, are provided.
Inventors:
KOMAI HIROMI
Application Number:
JP778997A
Publication Date:
August 04, 1998
Filing Date:
January 20, 1997
Export Citation:
Assignee:
SONY CORP
International Classes:
B23K3/06; (IPC1-7): B23K3/06
Attorney, Agent or Firm:
Oka-saki-Shintaro (1 person outside)
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