Title:
SOLDER VAMP FORMATION ONTO SEMICONDUCTOR SUBSTRATE
Document Type and Number:
Japanese Patent JPS5268366
Kind Code:
A
Abstract:
PURPOSE:When solder vamp is formed at electrode section on semiconductor substrate, the hole of metal mask is made into oval shape instead of round shape in the direction where no effect is given to adjacent electrodes. In this way, a sufficient solder amount can be secured.
Inventors:
UMEYAMA KAZUO
TAJIMA ZENZOU
HATANO KUNIO
TAJIMA ZENZOU
HATANO KUNIO
Application Number:
JP14396575A
Publication Date:
June 07, 1977
Filing Date:
December 05, 1975
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/60; B23K1/00; B23K1/20; H01L21/28; H01L21/285; (IPC1-7): B23K1/20; H01L21/28