Title:
SOLDERING IRON TIP
Document Type and Number:
Japanese Patent JPH08155633
Kind Code:
A
Abstract:
PURPOSE: To provide a soldering iron tip free from deterioration caused by use long-term by suppressing the occurrence of defective soldering associated with making the soldering iron tip fine.
CONSTITUTION: A surface perpendicular to the high heat conducting direction of a carbon-based fiber substrate 1 is formed on a solder wetting surface 2, and a surface perpendicular to a low heat conducting direction is formed on a nonwetting surface 3 of solder. A soldering iron tip is constituted by forming on iron plated layer 4 on the surface, by forming a solder plated layer 5 on the solder wetting surface on it, and by forming a chromium plated layer 6 on the solder nonwetting surface.
Inventors:
OKUYA NORIO
TANIMOTO KAZUO
MORI KAZUHIRO
TANIMOTO KAZUO
MORI KAZUHIRO
Application Number:
JP30202294A
Publication Date:
June 18, 1996
Filing Date:
December 06, 1994
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23K3/02; H05K3/34; (IPC1-7): B23K3/02; H05K3/34
Attorney, Agent or Firm:
Akira Kobiji (2 outside)
Previous Patent: SOLDERING IRON
Next Patent: BOXING JOINT OF STEEL FOR STRUCTURAL USE EXCELLENT IN FATIGUE RESISTANT CHARACTERISTIC AND WELDING M...
Next Patent: BOXING JOINT OF STEEL FOR STRUCTURAL USE EXCELLENT IN FATIGUE RESISTANT CHARACTERISTIC AND WELDING M...