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Patent Searching and Data


Title:
SOLDERING METHOD AND SOLDERING DEVICE
Document Type and Number:
Japanese Patent JPH11151572
Kind Code:
A
Abstract:

To ensure the electric connection of a coil to a terminal pin by performing the relative movement of the terminal pin to which an end part of the coil is connected to the molten solder in a solder bath to remove a film of the coil.

A pin 1 of a terminal block 12 of a resolver 10 is immersed in the molten solder 4 of a solder bath 3, and the terminal block 12 or the solder bath 3 is horizontally reciprocated through a relative moving means 20 comprising an actuator. The terminal pin 1 is relatively moved to the molten solder 4, the molten solder 4 is moved to an end part 2a of a coil 2, a film coated on the end part 2a of the coil 2 is peeled or solved through the heat and the movement of the molten solder 4, and the end part 2a whose film is removed is soldered to the terminal pin 1 with the molten solder 4. Thus, the end part 2a of the coil 2 can be completely and electrically connected to the terminal pin 1 after the film is removed.


Inventors:
ITO TAKAHIRO
Application Number:
JP31538297A
Publication Date:
June 08, 1999
Filing Date:
November 17, 1997
Export Citation:
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Assignee:
TAMAGAWA SEIKI CO LTD
International Classes:
B23K1/00; B23K1/08; B23K3/06; H01F41/10; H01R43/02; (IPC1-7): B23K1/08; B23K1/00
Attorney, Agent or Firm:
Soga Doteru (6 people outside)