PURPOSE: To provide a solid-state image sensing device which is capable of lessening a package in size, being surface-mounted on a space narrow in area, and being lessened in manufacturing cost.

CONSTITUTION: A lead frame 15 is hermetically fixed to a package 11 so as to extend its outer lead 15a outwards through a slot 14 which is provided in a recess 12 penetrating through its base, a solid-state image sensing element 17 electrically connected to the inner lead 15b of the lead frame 15 is housed in the recess 12, and an optical window plate 21 is hermetically fixed to the package 11 so as to block up the recess 12. By this setup, as the package 11 is not of split structure but of integral structure, it can be molded through a single molding die, the recess 12 can be enhanced in airtightness even if the package 11 is lessened in size, and a solid-state image sensing device of this constitution can be surface-mounted on a space of small area occupied by only the package 11 because the outer leads 15a are extended outwards through the base.