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Patent Searching and Data


Title:
SOLIDIFYING EXTRUSION MOLDING METHOD AND APPARATUS
Document Type and Number:
Japanese Patent JP2000313052
Kind Code:
A
Abstract:

To provide the method and apparatus for solidifying extrusion molding which improves molding speed.

In a solidifying extrusion molding method, the surface temp. of a molten crystalline resin is lowered to crystallizing temp. Tc°C or lower at the leading end part of a die, and a resin surface layer is solidified before the molten crystalline resin is extruded. The molten resin is held to a temp. range exceeding Tc°C and lower than (Tc+15)°C for a definite time before a resin surface layer is solidified. In a solidifying extrusion molding apparatus having a molten resin extruder and a die having a cooling zone 1 provided to its leading end part, the cross-sectional area of a part 6 of the resin flow passage in the cooling zone 1 of the die is smaller than that of a molded article.


Inventors:
KOBAYASHI MASATOSHI
Application Number:
JP12358899A
Publication Date:
November 14, 2000
Filing Date:
April 30, 1999
Export Citation:
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Assignee:
NIPPON KOKAN KK
International Classes:
B29C48/87; B29C48/30; B29K101/00; (IPC1-7): B29C47/78; B29C47/12
Attorney, Agent or Firm:
Shigeru Takano