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Title:
SOUND WAVE SENSOR
Document Type and Number:
Japanese Patent JP2006234522
Kind Code:
A
Abstract:

To provide a sound wave sensor which can reduce a dead zone as compared to a conventional one.

A transmitting element for generating a sound wave comprises a sound wave generation element which comprises a base substrate, a heat-producing layer formed on one surface of the base substrate, and a heat insulating layer interposed between the base substrate and the heat-producing layer on the one surface of the base substrate, generating a sound wave accompanied by a temperature change of the heat-producing layer through energization thereto. A transmitting element's side circuit board (a first support substrate) 3 in which the transmitting element 1 is installed and a receiving element's side circuit board (a second support substrate) 4 in which a receiving element 2 for receiving a sound wave reflected off an object Ob is installed are housed in a housing 50. The housing 50 is provided with a first window hole 52a allowing a transmitting face of the transmitting element 1 to be exposed and a second window hole 52b allowing a receiving face of the receiving element 2 to be exposed, which are opening parts allowing the transmitting face of the transmitting element 1 and the receiving face of the receiving element 2 to be exposed.


Inventors:
KITADA KOSAKU
YAMANAKA HIROSHI
GOTO HIROMICHI
Application Number:
JP2005048074A
Publication Date:
September 07, 2006
Filing Date:
February 23, 2005
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
G01S7/521; H04R17/00
Domestic Patent References:
JP2005020315A2005-01-20
JPH01127987A1989-05-19
JPH0597193U1993-12-27
JP2003520466A2003-07-02
JPH05100011A1993-04-23
JPS6234499A1987-02-14
JPS59115366U1984-08-03
Attorney, Agent or Firm:
Keisei Nishikawa
Atsuo Mori