Title:
球形フリップチップ型マイクロＬＥＤ及びその製造方法、表示パネル
Document Type and Number:
Japanese Patent JP7245557
Kind Code:
B2
Abstract:
A spherical flip-chip micro-LED, a method for manufacturing the spherical flip-chip micro-LED, and a display panel are provided. The spherical flip-chip micro-LED includes a light-emitting body, a supporting body, a first electrode, a second electrode, and an insulating protective layer. The supporting body is transparent. The first electrode and the second electrode are electrically coupled with the light-emitting body. The insulating protective layer covers the light-emitting body. The light-emitting body, the supporting body, and the insulating protective layer form a spherical structure.
Inventors:
Tang Biao
Liu Haiping
Feng Zhongshan
Liu Haiping
Feng Zhongshan
Application Number:
JP2021545982A
Publication Date:
March 24, 2023
Filing Date:
May 22, 2020
Export Citation:
Assignee:
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO.,LTD.
International Classes:
H01L33/20; G09F9/00; G09F9/30; G09F9/33
Domestic Patent References:
| JP2008004902A | ||||
| JP2017162980A | ||||
| JP2009049386A |
Foreign References:
| WO2008041771A1 | ||||
| US20050264172 | ||||
| US20130146905 | ||||
| CN109686824A |
Attorney, Agent or Firm:
Katsumi Iseki
Shuhei Kaneko
Wataru Onishi
Shuhei Kaneko
Wataru Onishi