To provide a spherical semiconductor device having improved connectivity with the outside.
A semiconductor device consists of a spherical semiconductor element 1 with at least one electrode 2 on the surface, and a conductive spherical bump 10 is formed at the position of the electrode 2 of the spherical semiconductor element 1. The electrode 2 is arranged so that it is brought into contact with a common plane. A set of spherical bumps 10 are arranged, so that they project from the spherical semiconductor element 1 in a manner such that a specific gap G is formed between a plane S or a spherical surface that touches one set of spherical bumps 10 to be connected to the outside and the surface of the spherical semiconductor element 1. A spherical semiconductor device is connected to each kind of circuit board, other semiconductor devices, or the like via the spherical bumps 10, thus realizing easy and accurate electrical connection to the outside.
SHIMOKAWA KENJI
HASHINO HIDEJI
TAKEDA NOBUO
FUKANO ATSUSHI
BALL SEMICONDUCTOR KK