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Title:
SPUTTER COATING DEVICE, AND ITS COATING METHOD
Document Type and Number:
Japanese Patent JPH01272765
Kind Code:
A
Abstract:

PURPOSE: To control the target corrosion, and to make sputtered film uniform, by disposing plural current holding coils and many ferromagnetic pole pieces symmetrically around the axis crossing a substrate and a target, and controlling the magnetization of the commonly used pole pieces.

CONSTITUTION: The recessed surface target 112 is supported by a supporting body 120 in a treating chamber 100 and the circular substrate 104 is opposed perpendicularly via a circular opening 102 to the target 112. A grounded circular anode 130 is arranged at the target 112 apart therefrom. The many ferromagnetic pole pieces 140 to 146 are connected to the supporting body 120 symmetrically around the axis intersecting with the substrate 104 and the target 112 and the current holding coils 150, 152 which may be separately excited are supported in this region. The currents passing these coils 150, 152 are controlled, by which magnetic fields may be formed and limited so as to concentrate ionizing electrons to the gas discharge region between the target 112 and the substrate 104. The target corrosion region is thus controlled at a high rate of concentration and the uniformity of the sputtered films is maintained for a long period of time.


Inventors:
UORUTAA HENRII KURASU
JIEEMUZU FURANKU SUMISU
Application Number:
JP4507889A
Publication Date:
October 31, 1989
Filing Date:
February 23, 1989
Export Citation:
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Assignee:
EATON CORP
International Classes:
C23C14/34; H01J37/34; (IPC1-7): C23C14/34
Domestic Patent References:
JPS61183467A1986-08-16
JPS63140078A1988-06-11
Attorney, Agent or Firm:
Yumi Kaida (2 outside)