PURPOSE: To obtain the title member improved in soldering affinity by formation of a sputtering film with a texture of granule-stacked structure on a solid ceramic member having a sputtering target and specific angle through bias sputtering technique.
CONSTITUTION: A solid ceramic member (e.g. of rectangular parallelepiped) consisting of e.g. AlN sintered compact is set on e.g. a parallel flat plate-type autorotation/revolution-type sputtering device. Using Ar gas, at each specified substrate revolution and autorotation numbers and substrate temperature, a specified power's RF together with 2KW of DC sputtering power is applied on the space between the substrate and a chamber to make a successive film formation from the ground side of Ti, Ni and Au films on the upper surface and four sides of the substrate through bias sputtering technique. Thus, a ductile, continuous and high-density film is formed on the upper surface of the substrate and a high-granular density film of granular structure is formed on each of the four sides, resulting in favorable soldering affinity for the member, leading to soldering with high reliability.
KIKUCHI HIROMI
HAYASHIDA TETSUYA
HITACHI LTD