Title:
SPUTTERING METHOD, SPUTTERING APPARATUS, PIEZOELECTRIC ELEMENT MANUFACTURING METHOD, AND LIQUID SPRAY HEAD
Document Type and Number:
Japanese Patent JP2006144090
Kind Code:
A
Abstract:
To provide a sputtering method, a sputtering apparatus, a piezoelectric element manufacturing method, and a liquid spray head having a piezoelectric element capable of depositing an excellent thin film of the uniform film thickness on a substrate.
When depositing a thin film by sputtering a target 402 on a surface of a substrate 110 arranged facing the target 402, the spacing (TS) between the surface of the target 402 and the surface of the substrate 110 is set to be ≥100 mm.
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Inventors:
MURAI MASAMI
RI KINZAN
RI KINZAN
Application Number:
JP2004337870A
Publication Date:
June 08, 2006
Filing Date:
November 22, 2004
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
C23C14/34; B41J2/16; B81B3/00; H01L41/09; H01L41/187; H01L41/22; H01L41/29; H01L41/319; H01L41/39
Attorney, Agent or Firm:
Hiroyuki Kurihara
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