To provide a sputtering system for forming a transparent conductive film in which the generation of particles is reduced.

The sputtering system 300 comprises: a substrate holding part 301 holding a substrate; opposing magnetic cathodes 302A and 302B arranged at the positions off-axis to the substrate holding part 301; a cathode box 303 storing the magnetic cathode 302A and 302B; and sticking prevention plates 311 and 312 arranged around the magnetic cathodes 302A and 302B. A target of a transparent conductive material is bonded to the surfaces of the magnetic cathodes 302A and 302B. A chimney 304 is provided between the substrate holding part 301 and the magnetic cathodes 302A and 302B. The sticking prevention plates 311 and 312 are coated with a material having a thermal expansion coefficient almost same as that of the transparent conductive material of the target.