Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
STAGE FOR PLACING WAFER
Document Type and Number:
Japanese Patent JPH05160246
Kind Code:
A
Abstract:

PURPOSE: To accurately measure a temperature during heating by gas heating medium by forming it of a gas sealing plate, a fine circular gold wire and a sealing surface of ceramics.

CONSTITUTION: A temperature of a wafer 2 in vacuum is measured from a rear surface of an infrared ray thermometer 1 through a gas shielding plate 7 introduced into a pore 5 formed at a center of a heat block 3. In this case, the plate 7 is sealed with a fine circular gold wire 8. The other surface of the wire 8 is formed of a mirror-polished surface 9 of alumina. Thus, since a heating stage is formed of the plate 7, the wire 8 and the alumina 9, the temperature of the wafer 2 at the time of heating with gas can directly be measured. Accordingly, if a wafer which does not reach a desired temperature is discovered, it is further additionally heated or can be removed as a defective product from the beginning.


Inventors:
YONEOKA YUJI
OKAMOTO AKIRA
KOBAYASHI HIDE
SHIMAMURA HIDEAKI
Application Number:
JP32024991A
Publication Date:
June 25, 1993
Filing Date:
December 04, 1991
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI LTD
International Classes:
H01L21/324; H01L21/68; H01L21/683; (IPC1-7): H01L21/324; H01L21/68
Attorney, Agent or Firm:
Ogawa Katsuo



 
Previous Patent: JPS5160245

Next Patent: JPS5160247