Title:
金めっき層を有するステンレス基板
Document Type and Number:
Japanese Patent JP5861652
Kind Code:
B2
Abstract:
The process of forming a partial gold-plating pattern on a stainless substrate includes a first plating step, a second plating step, and a stripping step. In the first plating step, pretreatment is applied to a stainless substrate including opposite main planes and a processing site formed of a plane different from the main planes, after which a first gold-plating layer is formed all over the surface of the stainless substrate using a hydrochloric acid plating solution. In the second plating step, mask plating is used to form a second gold-plating layer on the first gold-plating layer that covers the processing site in a desired pattern, and in the stripping step, a portion of the first gold-plating layer in an area where there is none of the second gold-plating layer is stripped off using an alkaline stripping solution.
Inventors:
Masahiro Nagata
Application Number:
JP2013020325A
Publication Date:
February 16, 2016
Filing Date:
February 05, 2013
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
C25D5/10; C25D5/02; C25D5/26; G11B21/21; H01M8/0202
Domestic Patent References:
| JP9022708A | ||||
| JP3257178A | ||||
| JP61243193A | ||||
| JP2009140789A | ||||
| JP2010524160A | ||||
| JP2001514705A |
Foreign References:
| KR1020060097955A |
Attorney, Agent or Firm:
Junzo Yoneda
Masataka Ota
Masataka Ota