Title:
STRUCTURE FOR COOLING HEAT RELEASING COMPONENT IN ELECTRONIC CIRCUIT
Document Type and Number:
Japanese Patent JPH03152997
Kind Code:
A
Abstract:
PURPOSE: To increase a lead wire in surface area so as to improve it in cooling effect by a method wherein the lead wire is rounded in spiral.
CONSTITUTION: Lead wires 2 of an electronic component main body 1 are rounded in spirals whose axes are parallel with each other, the component main body 1 is positioned through the tips of the rounded parts 4 and fixed to a printed board 3. By this rounded parts 4, the lead wires 2 are increased in surface area, whereby an electronic circuit heat releasing component cooling structure simple in constitution and improved in cooling effect can be obtained without plastic working for the formation of a rounded part.
Inventors:
KOBAYASHI EISAKU
Application Number:
JP29153489A
Publication Date:
June 28, 1991
Filing Date:
November 09, 1989
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01C1/084; H01C1/14; H01G2/08; H01G4/228; H01L23/34; H05K7/20; H05K1/02; H05K3/30; (IPC1-7): H01C1/084; H01C1/14; H01G1/08; H01G1/14; H01L23/34; H05K7/20
Attorney, Agent or Firm:
Iwao Yamaguchi